Features
Excellent soldering reliability,dimensional stability and chemical resistanceExcellent mechanical and Electrical propertiesCustomized thin copper good for fine line applicationLow profile conductive layer good for high frequency transmit
| PROPERTIES |
| Item | Condition | Unit | IPC/JIS Standard | Typical Value | Test Method | |
| Peel Strength(90C) | Normal | N/cm | ¡Ý5 | 8 | JIS C 6471 8.1 | |
| 288¡æ,5S | ¡Ý5 | 7 | JIS C 6471 8.1 | |||
| Folding Endurance | R0.8¡Á4.9N | Times | ¡ª | >10000 | JIS C 6471 8.2 | |
| Thermal Stress | 300¡æ,30S | ¡ª | No Delam. | No Delam. | JIS C 6471 9.3 | |
| Dimensional Stability | MD | E-0.5/150 | % | ¡À0.2 | ¡À0.02 | JIS C 6471 9.6 |
| TD | ¡À0.02 | JIS C 6471 9.6 | ||||
| Dielectric Constant | C-24/23/50 | ¡ª | ¡Ü4.0 | 3.3 | IPC-TM-650 NO.2.5.5.3 | |
| Dissipation Factor | C-24/23/50 | ¡ª | ¡Ü0.01 | 0.002 | IPC-TM-650 NO.2.5.5.3 | |
| Volume Resistivity | C-96/35/90 | MΩ.cm | 10 6 | 10 8 | JIS C 6471 7.2 | |
| Surface Resistance | C-96/35/90 | MΩ | 10 5 | 10 6 | JIS C 6471 7.1 | |
| Material and Thickness (¦Ìm) | Width | Length | |
| Polyimide Film | Copper foil | 250,500 | 50,100 |
| 12.5, 25, 38, 50 | 2, 5, 9, 12 | ||
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