Product
Features
Excellent soldering reliability,dimensional stability and chemical resistanceExcellent mechanical and Electrical propertiesCustomized thin copper good for fine line applicationLow profile conductive layer good for high frequency transmit
PROPERTIES
Item Condition Unit IPC/JIS Standard Typical Value Test Method
Peel Strength(90C) Normal N/cm 5 8 JIS C 6471 8.1
288,5S 5 7 JIS C 6471 8.1
Folding Endurance R0.84.9N Times >10000 JIS C 6471 8.2
Thermal Stress 300,30S No Delam. No Delam. JIS C 6471 9.3
Dimensional Stability MD E-0.5/150 % 0.2 0.02 JIS C 6471 9.6
TD 0.02 JIS C 6471 9.6
Dielectric Constant C-24/23/50 4.0 3.3 IPC-TM-650 NO.2.5.5.3
Dissipation Factor C-24/23/50 0.01 0.002 IPC-TM-650 NO.2.5.5.3
Volume Resistivity C-96/35/90 MΩ.cm 10 6 10 8 JIS C 6471 7.2
Surface Resistance C-96/35/90 MΩ 10 5 10 6 JIS C 6471 7.1

 

SPECIFICATIONS OF STANDARD PRODUCTS

Material and Thickness (m) Width Length
Polyimide Film Copper foil 250,500 50,100
12.5, 25, 38, 50 2, 5, 9, 12
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