Product
Features
High peel strength and excellent flexibility Customized design, achieve the high reliability interconnection, stainless steel to FPC, PCB to PCB and PCB to metal plate
PROPERTIES
Item Condition Typical Value
Conductivity Copper pad  1.0mm <200
Stainless steel pad  1.0mm <800
SS with nickel plating  1.0mm <200
Peel Strength Shiny copper foil with gold plating >10
Copper foil >15
Polyimide >12
Stainless steel >12
Thermal Shock Resistance 288 10Sec, 3 Times Pass

 

SPECIFICATIONS OF STANDARD PRODUCTS
Item Unit Release Film Coductive Adhesive Thickness After Lamination
Thickness
TCF4000 m 50 50,70 25,40
TCF8000 m 50 100(Including 50um conductive layer) 75
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