VERY LOW PROFILE COPPER FILM

Very low profile copper foil is an electrolytic copper foil produced by Guangzhou Fangbang Electronics Co., Ltd. It has low surface profile, high elongation and tensile strength, high peeling strength and superior heat stability. The company's current very low profile copper foil specifications are mainly 9μm, 12μm and 18μm. The copper foil have uniform thickness and fine micro-crystal structure, which can be widely used in HDI, FPC, PCB, CCL, FCCL and other fields.